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Tata Electronics Dholera 8+ years

Senior Manager_Projects

Senior Manager_Projects Job Details | Tata Electronics Private Limited We use cookies to offer you the best possible website experience. Your cookie preferences will be stored in your browser’s local storage. This includes cookies necessary for the website's operation. Additionally, you can freely decide and change any time whether you accept cookies or choose to opt out of cookies to improve website's performance, as well as cookies used to display content tailored to your interests. Your experience of the site and the services we are able to offer may be impacted if you do not accept all cookies. Modify Cookie Preferences Reject All Cookies Accept All Cookies Skip to main content Language English (United Kingdom) English (United States) Sign In Language English (United Kingdom) English (United States) Sign In Sign In Search by Keyword Show More Options Loading... Location All Department All Business All Clear Select how often (in days) to receive an alert: Create Alert × Select how often (in days) to receive an alert: Apply now » Senior Manager_Projects Senior Manager_Projects Job ID: 40363 Job ID: 40363 Date: Jul 27, 2026 Date: Jul 27, 2026 Location: Dholera, GJ, IN Location: Dholera, GJ, IN Department: Projects Department: Projects Business: Semifab Business: Semifab Purpose About The Business Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components. Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU), and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications, and artificial intelligence. Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’ Key Responsibility As a Semiconductor Tool Hookup Project Manager, you will lead the critical integration of high-tech manufacturing equipment into the fab infrastructure. You will own the end-to-end process of connecting process tools to essential utility systems—including gases, chemicals, ultra-pure water, and electrical power—to ensure they are online and production-ready. In this role, you will report to the Site Hookup Manager and will be assigned to a specific toolset or module (e.g., Lithography, Etch, Diffusion), serving as the dedicated expert for all hookup activities within that functional area. Safety Role Modelling: Serve as a visible champion for safety, consistently demonstrating and enforcing "Safety First" behaviours onsite and in the field to influence a zero-incident culture. Cross-Functional Coordination: Act as the central interface for tool hookup activities, coordinating closely with Facilities Construction for base-build alignment, Site Logistics for equipment move-in, Factory AHMS (Automated Material Handling Systems and the Hookup Design Team Project Lifecycle Management: Plan and execute tool installation projects from conception through to equipment sign-off and turnover. Stakeholder Alignment: Act as the primary liaison between Module Engineers, OEM Equipment Vendors, General Contractors, and Facility teams to ensure seamless integration. Schedule & Budget Control: Maintain detailed project schedules using tools like Primavera P6 or MS Project to meet strict delivery milestones within budget. Control and manage project changes in a structured way, ensuring all scope deviations are documented, impact-assessed, and approved through formal change control processes. Design, Quality Assurance & Utility Coordination: Review and approve hookup designs, engineering plans, and technical documents, ensuring compliance with industry standards, project specifications, and safety regulations. Manage the complex sequencing of connections for process piping, mechanical, electrical, and chemical systems to ensure high-quality, reliable utility integration. Risk Mitigation: Proactively identify potential issues and develop contingency plans to avoid delays. Lead the development and execution of recovery plans if projects fall behind schedule or encounter significant technical roadblocks. Field Leadership: Lead on-site teams and contractors, conducting inspections to verify installation quality and adherence to cleanroom standards and project specifications. Short Description B.S. degree in Engineering (Mechanical, Electrical, or Mechatronics) or Construction Management. Short Description 5–8+ years of direct experience in semiconductor construction or tool hookup project management Long Description Key Success Metrics Safety Performance: Achievement of zero recordable incidents and 100% compliance with EHS field protocols. Quality Assurance: Zero rework required following utility hookup and successful first time-right equipment sign-off. Schedule Predictability: Successful tool "Ready for Equipment" (RFE) dates met according to the master project baseline. Budget Adherence: Completion of hookup packages within the approved capital expenditure (CAPEX) forecast. Functional Area Control: Maintenance of real-time, accurate progress updates for assigned toolsets, ensuring all work-in-progress is in control and transparently communicated to senior leadership via structured reporting. Proven ability to read and interpret complex P&IDs (Piping and Instrumentation Diagrams), blueprints, and technical specifications to ensure accurate installation. Deep understanding of Fab utility systems, including process water/drains, specialty gases/chemicals, high-purity piping along with electrical and I&C Proficiency in using project management software such as Primavera P6 or PM Web, and familiarity with BIM platforms, specifically Navisworks, for design coordination and clash detection. Problem Solving & Leadership skills with ability to troubleshoot technical roadblocks in real-time, mediate contractor conflicts, people management, and organisational skills. Strong written and verbal communication with ability to communicate complex concepts clearly to both executive leadership and field trades. Capable of thriving in fast-paced, international startup environments or high-volume manufacturing (HVM) ramps. Learn More about TATA Electronics Go to website Learn More About Tata Electronics Apply now » Find similar jobs: Cookie Policy Disclaimer Privacy Policy Terms of Use-Career Terms of Use Opens in a new tab. Opens in a new tab. Opens in a new tab. Opens in a new tab. Opens in a new tab. Cookie Policy Privacy Policy Terms of Use Terms of Use-Career Disclaimer Copyright © Tata Electronics 2026. All rights reserved. × Cookie Consent Manager When you visit any website, it may store or retrieve information on your browser, mostly in the form of cookies. Because we respect your right to privacy, you can choose not to allow some types of cookies. However, blocking some types of cookies may impact your experience of the site and the services we are able to offer. Required Cookies These cookies are required to use this website and can't be turned off. Required Cookies Show More Details Required Cookies Provider Description Enabled SAP as service provider We use the following session cookies, which are all required to enable the website to function: "route" is used for session stickiness "careerSiteCompanyId" is used to send the request to the correct data center "JSESSIONID" is placed on the visitor's device during the session so the server can identify the visitor "Load balancer cookie" (actual cookie name may vary) prevents a visitor from bouncing from one instance to another Cookies from provider SAPasservice

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Kaynes Semicon Sanand Full Time

Job Openings

Job Openings Archive - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Job Openings Search Filter by All Job Category All Job Category Reliability Engineering & Failure Analysis Post-Silicon Engineering All Job Type All Job Type Full Time All Job Location All Job Location Sanand - Gujarat Gujarat Reliability Engineer Reliability Engineering & Failure Analysis Sanand - Gujarat More Details Failure Analysis Engineer Reliability Engineering & Failure Analysis Sanand - Gujarat More Details Product & Test Engineer (Probe & Final Test) Post-Silicon Engineering Sanand - Gujarat More Details Product Engineering Technician – Probe & Final Test Post-Silicon Engineering Sanand - Gujarat More Details Quality Engineer Post-Silicon Engineering Sanand - Gujarat More Details QA Supervisor Post-Silicon Engineering Sanand - Gujarat More Details Quality Operator Post-Silicon Engineering Sanand - Gujarat More Details Test Associate Equipment Engineer Post-Silicon Engineering Gujarat More Details Test Equipment Engineer Post-Silicon Engineering Gujarat More Details Production Supervisor Post-Silicon Engineering Sanand - Gujarat More Details Load more Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram

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Kaynes Semicon Sanand Full Time

Job Openings

Job Openings Archive - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Job Openings Search Filter by All Job Category All Job Category Reliability Engineering & Failure Analysis Post-Silicon Engineering All Job Type All Job Type Full Time All Job Location All Job Location Sanand - Gujarat Gujarat Reliability Engineer Reliability Engineering & Failure Analysis Sanand - Gujarat More Details Failure Analysis Engineer Reliability Engineering & Failure Analysis Sanand - Gujarat More Details Product & Test Engineer (Probe & Final Test) Post-Silicon Engineering Sanand - Gujarat More Details Product Engineering Technician – Probe & Final Test Post-Silicon Engineering Sanand - Gujarat More Details Quality Engineer Post-Silicon Engineering Sanand - Gujarat More Details QA Supervisor Post-Silicon Engineering Sanand - Gujarat More Details Quality Operator Post-Silicon Engineering Sanand - Gujarat More Details Test Associate Equipment Engineer Post-Silicon Engineering Gujarat More Details Test Equipment Engineer Post-Silicon Engineering Gujarat More Details Production Supervisor Post-Silicon Engineering Sanand - Gujarat More Details Load more Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram

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Kaynes Semicon Sanand Full Time

Job Openings

Job Openings Archive - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Job Openings Search Filter by All Job Category All Job Category Reliability Engineering & Failure Analysis Post-Silicon Engineering All Job Type All Job Type Full Time All Job Location All Job Location Sanand - Gujarat Gujarat Reliability Engineer Reliability Engineering & Failure Analysis Sanand - Gujarat More Details Failure Analysis Engineer Reliability Engineering & Failure Analysis Sanand - Gujarat More Details Product & Test Engineer (Probe & Final Test) Post-Silicon Engineering Sanand - Gujarat More Details Product Engineering Technician – Probe & Final Test Post-Silicon Engineering Sanand - Gujarat More Details Quality Engineer Post-Silicon Engineering Sanand - Gujarat More Details QA Supervisor Post-Silicon Engineering Sanand - Gujarat More Details Quality Operator Post-Silicon Engineering Sanand - Gujarat More Details Test Associate Equipment Engineer Post-Silicon Engineering Gujarat More Details Test Equipment Engineer Post-Silicon Engineering Gujarat More Details Production Supervisor Post-Silicon Engineering Sanand - Gujarat More Details Load more Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram

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Kaynes Semicon Sanand Full Time

Production Supervisor

Production Supervisor - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Production Supervisor Home » Job Openings » Production Supervisor Designation: Production Supervisor –Probe, Final Test and Test Backend (OSAT Semiconductor) Vacancies Availability: 3 positions Department: Probe/Final Test Reporting To: Production Manager / Operations Manager Job Purpose: Supervise Probe/Test/Post test operators and technicians during production shifts. Assign tasks, monitor performance, and provide coaching and feedback. Ensure procedures are followed, monitor equipment for optimal performance, and resolve basic issues while escalating complex problems. Conduct performance evaluations and support skill development. Organize daily production activities to meet targets and deadlines. Report daily production metrics, issues, and progress to management. Participate for process Simplification and Improvement. Lead the 5S and participate in Quality Improvement Program. Enforce EHS standards, conduct safety briefings, ensure proper PPE use, and maintain audit-ready documentation. Key Deliverables Report daily production metrics, issues, and progress to management. Provides daily updates on production output, quality, safety, and workforce issues. Executes manager’s plans on the shop floor. Escalates critical issues and resource needs to the manager. Maintains two-way communication for targets, priorities, and improvements. Facilitate / collaborate with support group to resolve issues in the production floor. Responsibilities A supervisor ensures that the operations run efficiently, meet quality standards, and resolve issues promptly to maintain production flow and customer satisfaction. Most significant responsibilities of the job which have a clear end result for the achievement of which the role holder will be held accountable. Production Ensure daily, weekly, and monthly production output meets planned targets in terms of quantity and quality Customer Meet customer commitments No feedback from internal / external Internal Processes Productivity, Quality, Safety, 5S People Develop operator skills Qualifications Bachelor’s degree in Electronics, Electrical Engineering, or Semiconductor Technology (Master’s preferred). 5–8 years of semiconductor experience, with at least 2–3 years in supervisory roles. Strong knowledge of Wafer Probe, Final Test and Test Backend processes in OSAT environments. Hands-on experience with 1. ATE platforms (Teradyne- (UFlex, J750, ETS364, ETS88) (Advantest -V93K, Acco Test, etc.), 2. Handler (Penta Master, SRM, Chroma etc. 3. Prober (TEL etc). Proficiency in SPC, FMEA, DOE, and root cause analysis tools. Excellent leadership, communication, and problem-solving skills. Competencies Analytical and detail-oriented mindset. Strong stakeholder management and customer orientation. Ability to lead cross-functional teams under tight schedules. Proactive in driving continuous improvement initiatives. Career Path This role offers progression toward Manager or Operations Manager , with opportunities to influence global OSAT quality strategies. Job Category: Post-Silicon Engineering Job Type: Full Time Job Location: Sanand - Gujarat Apply for this position Full Name * Email * Phone * Bio * Upload CV/Resume * Allowed Type(s): .pdf, .doc, .docx By using this form you agree with the storage and handling of your data by this website. * Previous Post Test Equipment Engineer Next Post Production Operator Share Share Share Share Pin Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram

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Kaynes Semicon Sanand 4+ years

Test Equipment Engineer

Test Equipment Engineer - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Test Equipment Engineer Home » Job Openings » Test Equipment Engineer Designation: Test Equipment Engineer Job Description: Kaynes semicon is looking for a skilled Test Equipment Engineer with strong technical back ground, must be passionate in trouble shooting test equipment’s, maintain test equipment’s and systems for Semiconductor device testing, collaborate with cross-functional teams to ensure efficient and accurate Testing, Purpose of the Job: To provide engineering & technical support on Evaluating / Installation /Buyoff / Setting up / PM/CAL for Test Equipment & interfaces (electrical & docking) that are used in the production testing of semiconductor ICs (Testers, handlers, Wafer Probers, Oven ..etc.) and to provide content expert support on final testing Key Job Accountabilities: Installation /Buyoff /Release of New IC testers, handlers and other wafer sort related equipment Install and buyoff to specs and ensure reliable functionality of the machines (Testers / Handlers / Probers) Expert Support on Trouble-shooting Testers, Handler Set Ups and other wafer sort Equipment To do repair and troubleshoot the issues encountered by Line Support/product engineering/mfg. Calibrate and maintain test equipment, carry out preventative maintenance and update PM records To establish & improve on operation /PM/CAL procedures for equipment Should be able to train others on these skills provide technical support and coaching to other Assistant engineers Prepare necessary training materials and provide hands on training/coaching on operation/PM/CAL Identify opportunities for upgrading equipment & streamlining maintenance operations, Knowledge, Skills, Abilities & improve equipment utilization Decrease equipment down time & improve overall equipment efficiency (OEE) Qualifications BE in Electrical/Electronics/Mechatronics or Diploma with 4+ years’ experience in Semiconductor Industry Hands on experience on Semiconductor equipment Advantest 93K, Teradyne UFEX, ETS#88, AccoTest, Aemulus , pick & place handlers & Wafer probers is an added advantage, Job Category: Post-Silicon Engineering Job Type: Full Time Job Location: Gujarat Apply for this position Full Name * Email * Phone * Bio * Upload CV/Resume * Allowed Type(s): .pdf, .doc, .docx By using this form you agree with the storage and handling of your data by this website. * Previous Post Test Associate Equipment Engineer Next Post Production Supervisor Share Share Share Share Pin Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram

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Kaynes Semicon Sanand Full Time

Test Associate Equipment Engineer

Test Associate Equipment Engineer - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Test Associate Equipment Engineer Home » Job Openings » Test Associate Equipment Engineer Designation: Test Associate Equipment Engineer Job Description: Kaynes semicon is looking for a Associate Test Equipment Engineer with strong technical back ground, must be passionate in trouble shooting test equipment’s, maintain test equipment’s and systems for Semiconductor device testing, Key Job Accountabilities: Develop preventive maintenance procedures to reduce equipment failures. Monitor equipment performance and suggest improvements. Maintain documentations for equipment installation, maintenance and troubleshooting procedures for reference purposes. Provide 24×7 support for troubleshooting equipment. Test and approve new equipment before handing off to production. Develop cost-reduction initiatives while still maintaining quality and productivity. Provide job assistance and conduct job trainings for employees as needed. Act as primary contact for equipment performance related questions and concerns. Qualifications Diploma in Electrical/Electronics/Mechatronics with 2 years’ experience semiconductor Industry Hands on experience on Semiconductor equipment Advantest 93K, Teradyne UFEX, ETS#88,AccoTest,Aemulus, pick & place handlers & Wafer probers is an added advantage Job Category: Post-Silicon Engineering Job Type: Full Time Job Location: Gujarat Apply for this position Full Name * Email * Phone * Bio * Upload CV/Resume * Allowed Type(s): .pdf, .doc, .docx By using this form you agree with the storage and handling of your data by this website. * Previous Post Quality Operator Next Post Test Equipment Engineer Share Share Share Share Pin Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram

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Kaynes Semicon Sanand Full Time

Quality Operator

Quality Operator - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Quality Operator Home » Job Openings » Quality Operator Designation: Quality Assurance (QA) Operator – Probe, Final Test & Test Backend Vacancies Availability: 6 positions Department: Quality Assurance, Final Test & Probe Reporting To: QA Supervisor / QA Manager Job Purpose: The QA Operator will perform quality assurance activities for Wafer Probe, Final Test and Test Backend operations in an OSAT (Outsourced Semiconductor Assembly and Test) environment. This role ensures that semiconductor devices meet customer specifications and industry standards through accurate testing, inspection, and documentation. Key Deliverables Execute QA checks during Probe, Final Test and Test Backend processes. Ensure compliance with ISO, IATF 16949, and JEDEC standards. Accurately record and report test results, yield data, and defect findings. Support root cause analysis and corrective actions for test failures. Maintain audit-ready documentation and quality records. Responsibilities Quality Execution Perform inspection and verification of semiconductor devices during Wafer Probe, Final Test and Test Backend. Operate and monitor 1. ATE platforms (Teradyne- (UFlex, J750, ETS364, ETS88) (Advantest -V93K, Acco Test, etc.), 2. Handler (Penta Master, SRM, Chroma etc. 3. Prober (TEL etc). 4. Test Backend Equipment. Identify and report test escapes, probe failures, and yield excursions. Process Support Assist engineers and supervisors in validating test programs, probe card and Test Backend performance. Follow established QA procedures, work instructions, and safety guidelines. Support continuous improvement initiatives in test accuracy and throughput. Documentation & Reporting Record test results, defect data, and reliability metrics in QA systems. Prepare daily/weekly reports for supervisors and management. Maintain proper documentation for audits and customer reviews. Team Collaboration Work closely with QA supervisors, engineers, and technicians. Participate in training sessions on test methodologies and quality systems. Support cross-functional teams in resolving quality issues. Qualifications Diploma or Bachelor’s degree in Electronics, Electrical Engineering, or related field. 2–5 years of experience in semiconductor QA or test operations. Hands-on experience with Wafer Probe, Final Test and Test Backend processes in OSAT environments. Familiarity with ATE platforms, probe cards, load boards and MSL Ovens. Basic knowledge of SPC, FMEA, and defect analysis tools. Strong attention to detail, documentation skills, and teamwork. Competencies Accuracy and consistency in test execution. Ability to follow procedures and safety standards. Good communication and reporting skills. Problem-solving mindset and willingness to learn. Career Path This role offers progression toward QA Technician, QA Engineer, or QA Supervisor, enabling growth within semiconductor quality assurance and operations. Job Category: Post-Silicon Engineering Job Type: Full Time Job Location: Sanand - Gujarat Apply for this position Full Name * Email * Phone * Bio * Upload CV/Resume * Allowed Type(s): .pdf, .doc, .docx By using this form you agree with the storage and handling of your data by this website. * Previous Post QA Supervisor Next Post Test Associate Equipment Engineer Share Share Share Share Pin Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram

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Kaynes Semicon Sanand Full Time

QA Supervisor

QA Supervisor - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram QA Supervisor Home » Job Openings » QA Supervisor Designation: QA Supervisor –Probe, Final Test and Test Backend (OSAT Semiconductor) Vacancies Availability: 1 positions Department: Quality Assurance, Probe & Final Test Reporting To: QA Manager / Operations Manager/ Head of Integration and Assurance Job Purpose: The QA Supervisor will lead and oversee quality assurance activities for Wafer Probe, Final Test and Test Backend operations in an OSAT (Outsourced Semiconductor Assembly and Test) environment. This role ensures compliance with industry standards, drives continuous improvement, and delivers high-quality semiconductor products that meet customer expectations. Key Deliverables Ensure zero-defect quality culture in Probe, Final Test and Test Backend processes. Achieve and maintain compliance with ISO, IATF 16949, and JEDEC standards. Deliver accurate yield, defect, and reliability reports to management and customers. Lead root cause analysis and corrective actions for test escapes and probe failures. Build and mentor a high-performing QA team. Responsibilities Quality Execution Supervise QA operations for Wafer Probe, Final Test and Test Backend. Monitor yield, defect density, and reliability metrics. Ensure adherence to customer specifications and industry standards. Process & Test Control Validate test programs, probe card performance, and ATE platforms. Drive corrective and preventive actions for yield excursions and probe issues. Implement SPC, FMEA, and DOE methodologies for process improvement. Leadership & People Development Manage and mentor QA engineers and technicians. Provide training on test methodologies, data analysis, and quality systems. Promote a culture of safety, accountability, and continuous learning. Customer & Supplier Engagement Represent QA during customer audits and reviews. Coordinate with suppliers on probe cards, load boards, and test equipment. Communicate quality issues and resolution status effectively. Reporting & Documentation Prepare dashboards and reports for yield, defect density, and OSAT performance. Maintain audit-ready documentation and certifications. Present improvement initiatives to senior management. Qualifications Bachelor’s degree in Electronics, Electrical Engineering, or Semiconductor Technology (Master’s preferred). 5–8 years of semiconductor QA experience, with at least 2–3 years in supervisory roles. Strong knowledge of Wafer Probe, Final Test and Test Backend processes in OSAT environments. Hands-on experience with 1. ATE platforms (Teradyne- (UFlex, J750, ETS364, ETS88) (Advantest -V93K, Acco Test, etc.), 2. Handler (Penta Master, SRM, Chroma etc. 3. Prober (TEL etc). Proficiency in SPC, FMEA, DOE, and root cause analysis tools. Excellent leadership, communication, and problem-solving skills. Competencies Analytical and detail-oriented mindset. Strong stakeholder management and customer orientation. Ability to lead cross-functional teams under tight schedules. Proactive in driving continuous improvement initiatives. Career Path This role offers progression toward QA Manager or Operations Manager, with opportunities to influence global OSAT quality strategies. Job Category: Post-Silicon Engineering Job Type: Full Time Job Location: Sanand - Gujarat Apply for this position Full Name * Email * Phone * Bio * Upload CV/Resume * Allowed Type(s): .pdf, .doc, .docx By using this form you agree with the storage and handling of your data by this website. * Previous Post Quality Engineer Next Post Quality Operator Share Share Share Share Pin Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram

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Kaynes Semicon Sanand Full Time

Quality Engineer

Quality Engineer - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Quality Engineer Home » Job Openings » Quality Engineer Designation: Quality Engineer (Probe Final Test & Test Backend) Vacancies Availability: 2 positions Industry: OSAT Semiconductor Manufacturing Position Overview: We are seeking a Quality Engineer with 2–3 years of experience in the OSAT (Outsourced Semiconductor Assembly and Test) industry, specializing in Probe, Final Test and Test Backend operations. The ideal candidate will ensure product quality, drive continuous improvement, and support customer satisfaction through robust quality systems and problem-solving methodologies. Key Responsibilities Monitor and maintain quality standards for Probe, Final Test and Test Backend processes in semiconductor manufacturing. Conduct root cause analysis and implement corrective/preventive actions for yield, reliability, and customer issues. Collaborate with cross-functional teams (Test Engineering, Product Engineering, Manufacturing, and Customer Quality) to resolve quality concerns. Develop and maintain quality documentation, including control plans, FMEAs, TCMs, ZD roadmaps and process flow diagrams. Support audits (internal, customer, and certification) and ensure compliance with industry standards (ISO, IATF, JEDEC). Address Customer Return related to Probe, Final Test and Test Backend operation through 8D Methodology and Quality related Tools and methodology Drive continuous improvement initiatives to enhance test coverage, reduce defects, and improve overall product reliability. Analyze test data to identify trends, anomalies, and opportunities for process optimization. Provide technical support to customers regarding quality-related inquiries and corrective actions. Qualifications Bachelor’s degree in Electronics, Electrical Engineering, Semiconductor Technology, or related field. 2–3 years of experience in Quality Engineering within the OSAT semiconductor industry. Hands-on experience with Probe, Final Test and Test Backed processes, including test program validation and probe card management. Strong knowledge of semiconductor device testing, yield analysis, and reliability standards. Familiarity with SPC, DOE, Six Sigma, and other quality improvement tools. Excellent problem-solving, analytical, and communication skills. Ability to work in a fast-paced, cross-functional environment. Preferred Skills Experience with customer quality management and handling RMA/8D reports. Knowledge of ESD, reliability testing, and industry-specific quality requirements. Certification in Lean Six Sigma (Green Belt or higher). Career Path This role offers opportunities to advance into Senior Quality Engineer or Quality Manager positions, with exposure to global semiconductor customers and cutting-edge technologies. Job Category: Post-Silicon Engineering Job Type: Full Time Job Location: Sanand - Gujarat Apply for this position Full Name * Email * Phone * Bio * Upload CV/Resume * Allowed Type(s): .pdf, .doc, .docx By using this form you agree with the storage and handling of your data by this website. * Previous Post Product Engineering Technician – Probe & Final Test Next Post QA Supervisor Share Share Share Share Pin Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram

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Kaynes Semicon Sanand Full Time

Product Engineering Technician – Probe & Final Test

Product Engineering Technician – Probe & Final Test - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Product Engineering Technician – Probe & Final Test Home » Job Openings » Product Engineering Technician – Probe & Final Test Department: Final Test and Probe Department. No of positions: 7 Reports To: Product Engineer / Senior Product Engineer Job Summary: The Product Engineering Technician will support Product Engineering activities at the Final Test & Probe of semiconductor manufacturing. The role focuses on execution, data collection, troubleshooting, and continuous improvement of test processes to ensure product quality, yield, and compliance with specifications. This position works closely with Product Engineers, Test Engineers, and Operations to support new product introduction (NPI), production ramp up, and high volume manufacturing (support day to day engineering activities and project. Key Responsibilities Final Test Support Support Product Engineers in final test & probe operations for semiconductor devices. Set up, operate, and qualify ATE test/probeprograms, handlers, probers, and load boards under guidance. Assist in execution of characterization, validation, and correlation tests during NPI and engineering builds. Willing to work in shift including weekend to support 24×7 FT & Probe Operations. Data Collection & Analysis Collect, log, and summarize test data, yield reports, and bin distributions. Assist in analyzing test failures, yield loss, and parametric outliers. Support lot disposition decisions with accurate and timely data reporting. Troubleshooting & Debug Perform basic first level troubleshooting for test hardware, sockets, contactors, and interface boards. Support failure analysis by reproducing issues and documenting observations. Escalate complex issues to Product / Test Engineers with clear problem statements. Documentation & Compliance Maintain test-related documentation, including work instructions, test logs, and change records. Ensure adherence to ESD, safety, quality, and cleanroom protocols. Support audits by providing required technical records and data. Continuous Improvement Assist in test time reduction, yield improvement, and scrap reduction activities. Participate in Kaizen, SPC monitoring, and root cause analysis efforts. Support qualification of new test hardware, sockets, and consumables. Required Qualifications Diploma / ITI / Bachelor’s degree in Electronics, Electrical, Instrumentation, Mechatronics, or related field. 1–5 years of experience in semiconductor testing, electronics manufacturing, or high tech production (fresh graduates with strong fundamentals may also be considered). Basic understanding of: 1. Semiconductor devices and manufacturing flow 2. Final test concepts and yield metrics 3. Electronic measurements and instrumentation Preferred Skills & Experience Hands-on experience with ATE systems, handlers, or probers (Advantest, Teradyne, etc. – preferred). Familiarity with test hardware: sockets, load boards, contactors. Basic data handling skills using Excel, JMP, or similar tools. Understanding of ESD control and cleanroom practices. Ability to work in shift-based manufacturing environments. Personal Attributes Strong attention to detail and discipline in following procedures Good communication skills and ability to work in cross functional teams Willingness to learn and adapt in a high tech, fast paced environment Problem-solving mindset with hands-on approach Work Environment Semiconductor fabrication / assembly test facility Cleanroom and production floor environment May require shift work based on production needs Job Category: Post-Silicon Engineering Job Type: Full Time Job Location: Sanand - Gujarat Apply for this position Full Name * Email * Phone * Bio * Upload CV/Resume * Allowed Type(s): .pdf, .doc, .docx By using this form you agree with the storage and handling of your data by this website. * Previous Post Product & Test Engineer (Probe & Final Test) Next Post Quality Engineer Share Share Share Share Pin Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram

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Kaynes Semicon Sanand Full Time

Product & Test Engineer (Probe & Final Test)

Product & Test Engineer (Probe & Final Test) - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Product & Test Engineer (Probe & Final Test) Home » Job Openings » Product & Test Engineer (Probe & Final Test) Vacancies Availability: 14 positions Company Description: Kaynes Semicon is located in GIDC, Sanand, Ahmedabad, India. Kaynes Semicon builds advanced semiconductor assembly, packaging, test, and reliability capability to enable silicon technologies to scale into industrial manufacturing. Our Vision is to be the global benchmark in semiconductor manufacturing, transforming advanced silicon into scalable, high-reliability solutions. Job Summary: We are seeking an experienced Product & Test Engineer to support end to end semiconductor product development, including silicon bring up, test program development, characterization, yield improvement and high volume manufacturing (HVM) support in OSAT (Outsourced Semiconductor Assembly and Test) environment. Responsibilities: Work with cross-functional teams on new product introduction/development through the entire NPI development cycle (Concept, definition, execution, product launch/ramp) or new product transfer from customer site for capacity expansion. Translates product specification and system requirements into test requirements and coverage methods. Support development of ATE test hardware requirements and review schematics and plots for probe card and device interface board. Drive Cost Reduction: Test Time Reduction, flow reduction and Yield Improvement. Perform yield enhancement by identifying fail modes, quantity of material affected, fallout rate, etc. Characterization (CZ) activities – Defining matrix lots, generating CZ flow, ATE CZ data collection, performing bench measurements, micro probing, thermal evaluation, data analysis, presenting and generating reports. Perform ATE data collection and failure characterization to determine the failure mechanism(s). Collaborate with Assembly, Quality & Reliability team and customer to qualify new package, BOM supplier or die revision. Assist with Customer Quality Incident investigations (ATE test, lab analysis and failure analysis support) Generate technical documentation such as statistical analysis report, evaluation summary report, lessons learned. Assist in correlating critical ATE parametric measurements correlate with lab measurements. Help drive new innovative solutions and methodologies to improve cycle time and cost. Own and manage PE deliverables working with cross functional teams. Job Qualifications: B.E./B.Tech or M.E./M.Tech in Electronics, Electrical, Computer Engineering or relevant disciplines. Proven industry experience in semiconductor ATE Product & Test Engineering for Probe and/or Final Test with min experience of 2 years. Strong programming and scripting skills, including Python, C/C++, TCL, or Perl for ATE automation and data processing. Hands-on expertise with major ATE platforms, such as: Teradyne UltraFlex, J750, Advantest V93K, National Instruments (NI), CoHu, Aemulus and AccoTest. Experience in TTR activities and PVT (Process/Voltage/Temperature) characterization on corner testing. Solid knowledge of integrated circuits in CMOS, BJT, IGBT, Power IC Devices, IPMs. Basic skills in statistics and familiarity with JMP software/Minitab software is a plus. Strong analytical capabilities in data analysis, statistical decision making and problem-solving. Strong written and verbal communication skills. Self-motivated. Able to plan, execute and deliver within given timeline. Strong team player with leadership, negotiation, and collaboration skills. Experience working with OSATs, including NPI, correlation, production qualification and Mass production is a plus. Hands-on with Handlers and Probers is a plus. Good Understanding in test hardware, including load boards, probe cards, and socket. Job Category: Post-Silicon Engineering Job Type: Full Time Job Location: Sanand - Gujarat Apply for this position Full Name * Email * Phone * Bio * Upload CV/Resume * Allowed Type(s): .pdf, .doc, .docx By using this form you agree with the storage and handling of your data by this website. * Previous Post Failure Analysis Engineer Next Post Product Engineering Technician – Probe & Final Test Share Share Share Share Pin Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram

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