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Kaynes Semicon Inside Semicon Job #190

Product Engineering Technician – Probe & Final Test

✓ Official Career Gujarat Priority Design / VLSI
Sanand, Gujarat, India Full Time 2026-08-22
Job Source
Kaynes Semicon Careers
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Job Description

Product Engineering Technician – Probe & Final Test - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Product Engineering Technician – Probe & Final Test Home » Job Openings » Product Engineering Technician – Probe & Final Test Department: Final Test and Probe Department. No of positions: 7 Reports To: Product Engineer / Senior Product Engineer Job Summary: The Product Engineering Technician will support Product Engineering activities at the Final Test & Probe of semiconductor manufacturing. The role focuses on execution, data collection, troubleshooting, and continuous improvement of test processes to ensure product quality, yield, and compliance with specifications. This position works closely with Product Engineers, Test Engineers, and Operations to support new product introduction (NPI), production ramp up, and high volume manufacturing (support day to day engineering activities and project. Key Responsibilities Final Test Support Support Product Engineers in final test & probe operations for semiconductor devices. Set up, operate, and qualify ATE test/probeprograms, handlers, probers, and load boards under guidance. Assist in execution of characterization, validation, and correlation tests during NPI and engineering builds. Willing to work in shift including weekend to support 24×7 FT & Probe Operations. Data Collection & Analysis Collect, log, and summarize test data, yield reports, and bin distributions. Assist in analyzing test failures, yield loss, and parametric outliers. Support lot disposition decisions with accurate and timely data reporting. Troubleshooting & Debug Perform basic first level troubleshooting for test hardware, sockets, contactors, and interface boards. Support failure analysis by reproducing issues and documenting observations. Escalate complex issues to Product / Test Engineers with clear problem statements. Documentation & Compliance Maintain test-related documentation, including work instructions, test logs, and change records. Ensure adherence to ESD, safety, quality, and cleanroom protocols. Support audits by providing required technical records and data. Continuous Improvement Assist in test time reduction, yield improvement, and scrap reduction activities. Participate in Kaizen, SPC monitoring, and root cause analysis efforts. Support qualification of new test hardware, sockets, and consumables. Required Qualifications Diploma / ITI / Bachelor’s degree in Electronics, Electrical, Instrumentation, Mechatronics, or related field. 1–5 years of experience in semiconductor testing, electronics manufacturing, or high tech production (fresh graduates with strong fundamentals may also be considered). Basic understanding of: 1. Semiconductor devices and manufacturing flow 2. Final test concepts and yield metrics 3. Electronic measurements and instrumentation Preferred Skills & Experience Hands-on experience with ATE systems, handlers, or probers (Advantest, Teradyne, etc. – preferred). Familiarity with test hardware: sockets, load boards, contactors. Basic data handling skills using Excel, JMP, or similar tools. Understanding of ESD control and cleanroom practices. Ability to work in shift-based manufacturing environments. Personal Attributes Strong attention to detail and discipline in following procedures Good communication skills and ability to work in cross functional teams Willingness to learn and adapt in a high tech, fast paced environment Problem-solving mindset with hands-on approach Work Environment Semiconductor fabrication / assembly test facility Cleanroom and production floor environment May require shift work based on production needs Job Category: Post-Silicon Engineering Job Type: Full Time Job Location: Sanand - Gujarat Apply for this position Full Name * Email * Phone * Bio * Upload CV/Resume * Allowed Type(s): .pdf, .doc, .docx By using this form you agree with the storage and handling of your data by this website. * Previous Post Product & Test Engineer (Probe & Final Test) Next Post Quality Engineer Share Share Share Share Pin Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram

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