Curated semiconductor intelligence covering companies, technology, investment, policy, talent and India's growing chip ecosystem.
Tata group seeks 80 acres more to expand Dholera semiconductor chip plant Business Standard
Tata Electronics to make up display semiconductor chips in Gujarat Business Standard
Dholera semiconductor plant to use ASML tech, says Ashwini Vaishnaw Business Standard
CG Power gains after arm establishes OSAT facility in Gujarat Business Standard
India Semiconductor Mission, Tata ink fiscal pact for Gujarat chip plant Business Standard
PM Modi to inaugurate semiconductor OSAT plant in Gujarat on March 31 Business Standard
Welcome to Nasa's latest Wind Tunnel, the Flight Dynamics Research Facility (FDFR). The location is the agency's Langley Research Center in Hampton, Virginia. The post Picture of the Day: Welcome to the Wind Tunnel appeared first on Electronics Weekly .
PYE’S plans to plant a foot firmly in the Common Market under the blue Italian sky follow a lead already made by a number of British firms in electronics. Indeed, […] The post Pye’s Plans appeared first on Electronics Weekly .
Qorvo’s QPA0023 is a high-performance driver amplifier fabricated on Qorvo’s production 0.15 um pHEMT process (QPHT15). Covering 6 – 18 GHz, the QPA0023 provides 14 dB small signal gain and […] The post 6 – 18 GHz Driver Amplifier appeared first on Electronics Weekly .
Q2 silicon wafer shipments increased 7.4% YoY to 3,573 million square inches (MSI) from the 3,327 MSI recorded in Q2 2025 and 9.1% QoQ from the 3,275 MSI recorded oc […] The post Q2 wafer shipments up 7.4% YoY appeared first on Electronics Weekly .
DeepX, the 7 year-old Korean IC designer, has raised a $30 million Series D at a valuation of $2.2 billion. Investors were DeepX’s existing backers existing backers BNW Investment and […] The post DeepX raises $30m Series D at $2.2bn valuation appeared first on Electronics Weekly .
Japan is hooking up with companies in Ukraine and the US to stimulate local participation in the defence drone market which is currently 91% supplied by Chinese firms. Under a […] The post Japan taps Ukraine, US and startups for defence drone capability appeared first on Electronics Weekly .
Military AI faces hackers, poisoned data, and weak rules; lock it down with zero trust, red-teaming, and real governance. The post Protecting Military AI Agents From Cyberthreats appeared first on EE Times .
Toolchain capability is no longer the limiting factor in heterogeneous chiplet design. The bottleneck is the computational cost of multi-physics co-simulation across 2.5D and 3D stacks. The post Why Simulation Speed Is Holding Chiplets Back appeared first on Semiconductor Engineering .
Building hyper-large form factor packages that measure up to 240 mm x 240 mm with reliable encapsulation. The post From Blueprint To Build: Engineering The World’s Largest AI Chips appeared first on Semiconductor Engineering .
Stretchable electronics: Switchable analog, digital organic transistor; thread-based ICs; temporary e-tattoo electrodes. The post Research Bits: Aug. 4 appeared first on Semiconductor Engineering .
Hybrid NAND flash-DRAM memory; neuromorphic many-core computing; modular HW-SW leakage verification; bridging p-type gap in oxide electronics w/2D semis; 3D structures from wafer-fabricated precursors; LLM benchmarking for Verilog design flows; pre-silicon power side-channel analysis. The post Chip Industry Technical Paper Roundup: Aug. 4 appeared first on Semiconductor Engineering .
Instead of working out how to replace junior engineers with AI, develop better ways to train and build fresh minds with new ideas. The post Invest In Junior Engineers appeared first on Semiconductor Engineering .
Prime Minister Shri Narendra Modi inaugurates the CG Semi Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat PIB
NXP’s Trimension Ultra-Wideband (UWB) ranging and radar solutions will be deployed by the BMW Group across its fleet, starting with selected 2026 vehicle programs NXP’s Trimension NCJ29D6 family allows OEMs to use one UWB system for multiple use cases, from presence detection to hands-free car
Samsung Electronics today announced that Prime Video will be the first streaming service to offer HDR10+ ADVANCED on supported titles globally beginning August 2026, with the service being first available on Samsung’s 2026 TV lineup. The next-generation High Dynamic Range (HDR) standard — designed to deliver brighter, more immersive picture quality for supported movies and […]
ChipAgents raises $60M as EDA’s AI gold rush heats up, pitching autonomous chip-design agents over tired copilots. The post Video Interview: ChipAgents CEO on Latest Funding for Agentic AI in EDA appeared first on EE Times .
Renesas’s Gen 3 DDR5 MRDIMM attacks AI’s memory choke point with 16,000 MT/s bandwidth and no platform overhaul. The post Renesas Tackles Memory Bottleneck with MRDIMM Update appeared first on EE Times .
Researchers from Technische Universität Dresden and University of Manchester published a technical paper titled “The SpiNNaker2 Chip: A Many-Core Platform for Flexible and Scalable Brain-Inspired Computing.” Abstract Excerpt: The paper presents SpiNNaker2 as a chip that “bridges the gap between deep networks and neuromorphic computing” and reports “ up to 4.5 TOPS in high performance... » read more The post Chip Bridges Neuromorphic And Deep-Network Computing (TU Dresden) appeared first on Semiconductor Engineering .
Prime Minister Shri Narendra Modi inaugurates the CG Semi Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat PIB
Tesla saw its revenue and deliveries rise again this quarter, but the Q2 profit margin of 16.7%, was down from 17.2% in Q2 2025 and 21.1% in Q1 2026. Tesla’s […] The post Tesla Q2 Revenues and Deliveries Rise, Margin Falls appeared first on Electronics Weekly .
Earlier today, OLIX the two year-old London AI chip startup founded by James Dacombe (pictured) announced a $312m Series B financing round at a $3.3 billion valuation. The round included […] The post London AI chip startup OLIX raises $312m appeared first on Electronics Weekly .
The longtime chairman of the Jedec standards body, Mian Quddus, is to receive the 2026 FMS Lifetime Achievement Award tomorrow. The award will be presented to Mr. Quddus, pictured, at […] The post Mian Quddus to receive Jedec FMS lifetime achievement award appeared first on Electronics Weekly .
Semiconductor equipment spending is entering a new growth cycle shaped by geopolitics, sovereignty strategies, and technology roadmaps, despite uneven end-market demand Wafer Fab Equipment (WFE) sales revenue is expected to […] The post Wafer fab equipment market set to eexplode appeared first on Electronics Weekly .
CMP Semiconductor Fab Equipment Maintenance Technician careers.micron.com
Prime Minister shares glimpses from inauguration of CG Semi Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat PIB
The US Air Force Research Laboratory (AFRL) has demonstrated autonomous control of a satellite bus using a neural network. The organisation describes it as a pivotal shift for the use […] The post Neural network controls satellite bus in orbit appeared first on Electronics Weekly .
Ambarella has quietly transformed its automotive computer-vision technology to serve edge AI applications. The post NXP Eying Ambarella: Is It About Automotive or Edge AI? appeared first on EE Times .
AI workloads are pushing automotive sensors harder, forcing engineers to rethink how long safety-critical systems can be trusted. The post Self-Driving Cars Have An Aging Problem appeared first on Semiconductor Engineering .
PM Modi to Inaugurate Micron’s ATMP Semiconductor Plant in Sanand on Feb 28 DeshGujarat
To promote the launch of Galaxy Z Fold8, Samsung Gulf Electronics recently teamed up with Skydive Dubai to perform a bold aerial display, in which a team of professional skydivers formed the phone’s unfolded shape thousands of feet above the Palm Jumeirah in Dubai, one of the UAE’s premier skydiving landmarks. Weighing just 201 grams, […]
![[Interview] [Galaxy Unpacked July 2026] Inside the Design Behind the Latest Galaxy Z Series and Galaxy Watch](https://img.global.news.samsung.com/global/wp-content/uploads/2026/08/03102759/Samsung-Mobile-Galaxy-Unpacked-July-2026-Inside-the-Design-Galaxy-Z-Series-Galaxy-Watch_Thumb932-728x410.jpg)
On July 22 at Galaxy Unpacked July 2026, Samsung Electronics introduced Galaxy Z Fold8 Ultra, Galaxy Z Fold8, Galaxy Z Flip8, Galaxy Watch Ultra2 and Galaxy Watch9. From foldables to smartwatches, Samsung’s latest Galaxy devices take different forms but share the same design philosophy — comfort. Samsung Newsroom spoke with Hubert Lee, Executive Vice President […]
The FIFA wheeze to sell off a proportion of the organisation’s marketing rights may have bitten the dust but I’m a connoisseur of wicked wheezes and this one has triggered […] The post Ed Covets The FIFA Wheeze appeared first on Electronics Weekly .
Kioxia is sampling UFS 5.0 NAND in 1 TB and 512 GB capacities and plans mass production by the end of the year. Built on the JEDEC UFS 5.0 standard, […] The post 1Tb and 512Gb UFS NAND samples available appeared first on Electronics Weekly .
The deployment of 5G is projected to increase for another two years, boosting demand for microwave transmission equipment, says Dell’Oro. “We anticipate at least two more years of growth for […] The post Microwave transmission equipment growth has two more years appeared first on Electronics Weekly .
Rohm has launched the English-language version of Engineer Social Hub, an online platform designed to make its technical information, know-how, and support more accessible to engineers. Engineer Social Hub brings […] The post Engineer Social Hub appeared first on Electronics Weekly .
Kioxia has forecast a $7.91 billion profit for Q3 and plans to buy back 5.5% of its shares. The $5 billion cost of the buy-back is 170% of its planned […] The post Kioxia expects Q2 profit of $7.94 billion appeared first on Electronics Weekly .
TSMC is ahead of schedule in the construction of its $49 billion 1.4nm fab in Taichung’s Central Taiwan Science Park, reports the Commercial Times. Construction started in November 2025. First […] The post TSMC ahead of schedule with 1.4nm fab appeared first on Electronics Weekly .
We analyzed 70 customer case studies to better understand the ERP experiences of small manufacturers. Here’s what electronics manufacturers had to say. The post ERP Statistics: Insights From 70 Manufacturing Case Studies appeared first on EE Times .
This white paper examines emerging humanoid robot architectures, focusing on how joints and dexterous hands are becoming intelligent, sensor-rich subsystems that require tightly integrated control, communication, and edge processing. It outlines key design challenges and opportunities for building scalable, high-performance humanoid manipulation systems. The post Humanoid Manipulation at the Edge of Physical Interaction appeared first on EE Times .
Researchers from MIT, Google, and University of Washington published a technical paper titled “Granite: A Modular Methodology for Foundational Verification of Hardware-Software Leakage Contracts.” Abstract Excerpt: “Granite is a methodology for modular verification of both functional correctness and nonleakage of RTL processors against ISA contracts. We prove that the cycle-by-cycle timing of a pipelined RISC... » read more The post Modular Verification of RTL Processors Against ISA Contracts (MIT, Google, UW) appeared first on Semiconductor Engineering .
Sanand News Prime Minister Narendra Modi to inaugurate semiconductor OSAT plant in Sanand on March 31 Sandesh News
PM Modi Inaugurates CG Semi OSAT Semiconductor Facility in Sanand Sandesh News
Micron and Intel NAND Technology Wins Prestigious UBM TechInsights' Semiconductor of the Year Award Micron
PM Modi Interacts with Women Employees at Sanand Semiconductor Facility Sandesh News
Prime Minister shares glimpses from inauguration of CG Semi Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat PIB
Join this webinar and explore how Microchip's framework translates architectural intent into component choices that preserve differentiation and margin. The post Hybrid Architectures for Space Missions: Frameworks and Consequence appeared first on EE Times .
AI’s memory wall is turning packaging into architecture as CEA-Leti bets on 3D stacking, chiplets, and cooler power. The post CEA-Leti Pushes Stacking Roadmap as AI Runs into Memory and Power Limits appeared first on EE Times .
At the 2000 ISS Taiwan the talk was about how the cell phone would impact the PC with the phone expected to become more datacentric and the PCs more portable, […] The post When Phones Threatened PCs appeared first on Electronics Weekly .
Join us to learn how Altera is supporting commercial deployments in orbit today and what's coming next. The post The Commercial Space Race: Powering the Next Comms Network appeared first on EE Times .
Data Science in semiconductor memory manufacturing Micron
PM Narendra Modi In Gujarat Gujarat has become the countrys semiconductor hub PM Narendra Modi will inaugurate the semiconductor ATMP facility in Sanand today Sandesh News
PM Modi to inaugurate semiconductor OSAT plant in Sanand on March 31 Sandesh
IIT Gandhinagar Partners with Cyient Foundation and Cyient Semiconductors to Strengthen Semiconductor Talent and Research PIB
Prime Minister shares glimpses from inauguration of CG Semi Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat PIB
"India Has Entered a New Era in Semiconductors" Says Union Minister Ashwini Vaishnaw as CG SEMI's OSAT Facility Begins Commercial Production in Sanand PIB
EINDHOVEN, The Netherlands, July 28, 2026 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) today reported financial results for the second quarter, which ended June 28, 2026. “NXP delivered second-quarter revenue of $3.5 billion, up 19 percent year-on-year and 10 percent sequentially,
LOI for CHIPS R&D award advances the optical technologies powering AI and high-performance computing MALTA, N.Y., July 29, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) today announced it has entered into a letter of intent (LOI) with the U.S.
Samsung Electronics has unveiled The Fold Inn, a limited-time immersive pub experience in London’s Soho neighborhood, to celebrate the launch of Galaxy Z Fold8 Ultra, Galaxy Z Fold8 and Galaxy Z Flip8 at Galaxy Unpacked July 2026 in London. Inspired by the design and versatility of Samsung’s foldable devices, the venue reimagines the traditional British pub […]
Samsung Electronics today reported financial results for the second quarter ended June 30, 2026. The Company posted KRW 171.5 trillion in consolidated revenue, another all-time quarterly high, representing a quarter-on-quarter (QoQ) increase of 28%. Operating profit also reached another all-time high, increasing to KRW 89.5 trillion. Earnings per share for both common and preferred shares […]
![[Interview] [Galaxy Unpacked July 2026] Inside the Engineering Behind the Latest Galaxy Z Series](https://img.global.news.samsung.com/global/wp-content/uploads/2026/07/30103222/Samsung-Mobile-Galaxy-Unpacked-July-2026-Inside-the-Engineering-Interview_Thumb932_F-728x410.jpg)
On July 22 at Galaxy Unpacked July 2026, Samsung Electronics unveiled Galaxy Z Fold8 Ultra, Galaxy Z Fold8 and Galaxy Z Flip8, marking the eighth generation of the Galaxy Z series. Across seven generations, Samsung has helped define the foldable category through advances in display technology, hinge engineering and materials innovation — all driven by […]
![[Interview] [Galaxy Unpacked July 2026] Intelligent Eyewear: The First Step Toward the Next Mobile AI Interface](https://img.global.news.samsung.com/global/wp-content/uploads/2026/07/30160657/Samsung-Mobile-Galaxy-Unpacked-July-2026-Intelligent-Eyewear-Interview_Thumb932-728x410.jpg)
On July 22 at Galaxy Unpacked July 2026, Samsung Electronics introduced intelligent eyewear as the first step toward making AI glasses the next interface for mobile AI. Built on decades of expertise in mobile engineering, hardware design and product craftsmanship, intelligent eyewear combines true wearability with mobile AI experiences and seamless connectivity within the Galaxy […]
![[Video] Unfolding New Experiences With the Galaxy Z Series](https://img.global.news.samsung.com/global/wp-content/uploads/2026/07/30161913/Samsung-Mobile-Galaxy-Unpacked-July-2026-Foldables-Video-News_Thumb932-728x410.jpg)
AI has become part of everyday life — from editing photos and videos to planning trips and creating and enjoying content. Samsung Electronics’ new Galaxy Z Fold8 Ultra, Galaxy Z Fold8 and Galaxy Z Flip8 expand everyday experiences even further. Combining agentic AI with the versatility of the foldable form factor, the new Galaxy Z […]
Open source software is a critical pillar of the global economy. It underpins cloud computing, financial services, manufacturing, telecommunications, government and internet services by making technology accessible and observable to communities of experts. Cybersecurity is among the top three beneficiaries of open source software. The Open Secure AI Alliance — building on the leadership of […]
As a discerning AI investor who values style and substance, Sarah Guo knows this season’s standout accessory isn’t the latest designer purse — but what’s inside it. In a recent video, Guo, founder of AI-native venture capital firm Conviction and co-host of the AI podcast No Priors, highlighted how the NVIDIA Jetson platform for edge […]
Back to school means balancing assignments, deadlines and downtime. GeForce NOW makes it easy to have it all. With cloud gaming, everyday laptops used for class can also become GeForce RTX-powered gaming setups. When it’s time to switch from studying to gaming, members can jump into Halo: Campaign Evolved, as GeForce NOW is bringing one […]
What’s New: Intel Foundry has completed the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. Launched in September 2021, the program supported development of domestic, leading-edge CMOS technology and manufacturing in the United States, establishing a foundation for expanded trusted domestic semiconductor manufacturing.“The collaboration between the DoW and Intel on the Trusted & Assured Microelectronics … The post Intel Completes RAMP-C Program, Accelerating Momentum for Secure Enclave appeared first on Newsroom .
As AI demands unprecedented "brain power," the semiconductor industry is moving past the era of relying on single, massive chips. Advanced packaging is the essential craft of interconnecting multiple specialized chips together. This allows them to function as a single, powerful unit that runs faster handling the massive workloads of the future.Intel’s been doing advanced … The post Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors appeared first on Newsroom .
Samsung reported a $62bn Q2 profit for its chip division up 250-fold y-o-y. The company had Q2 revenue of $119bn. “The supply shortage in 2027 is expected to worsen compared […] The post Samsung Q2 chip profit hits $62bn appeared first on Electronics Weekly .
Intel is intending to ship RTL code for its x86 Atom processor to Rosaic Labs, a startup incorporated last May, reports Reuters. Rosaic CEO Amarjit Gill (pictured) and Intel CEO […] The post Intel to license x86 RTL code appeared first on Electronics Weekly .
A Nobel Physics Laureate who is 101 years old laid down five rules for being a successful researcher: Don’t allow yourself to be trapped by your past experiences. Don’t allow […] The post Fable: The Wise Laureate appeared first on Electronics Weekly .
Europe’s wildfire season used to typically run from July to September, but now data shows that it is getting longer and more intense. By July 22nd the burned area in […] The post Wildfire appeared first on Electronics Weekly .
Cumulative spending on datacentre switches deployed in AI back-end networks to support next generation AI infrastructure is forecast to approach $1tn over the next five years (2026-2030), says Dell’Oro. Scale-up […] The post Back-end AI datacentre network switches head for $1tn market appeared first on Electronics Weekly .
Infineon is shipping the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators, photovoltaic relays and electromechanical relays. Housed in aPG-DSO-8 […] The post Infineon shipping isolator ICs for high-volume applications appeared first on Electronics Weekly .
Element14 has launched a home and healthcare design challenge inviting engineers, makers and technology enthusiasts to design and build a prototype smart home or healthcare system designed to support a […] The post Element14 poses home and healthcare design challenge appeared first on Electronics Weekly .
At his final results call Tim Cook turned in some pretty good numbers in a tough consumer electronics market. Apple had fiscal Q3 (calendar Q2) revenues up 16.4% y-o-y at […] The post Cook’s curtain call appeared first on Electronics Weekly .
The first company to get regulatory approval for a genuinely driverless robotaxi is Amazon’s Zoox (pictured). Zoox has been licensed to deploy 2,500 vehicles annually for two years The US […] The post First genuinely driverless robotaxi gets regulatory approval appeared first on Electronics Weekly .
Amazon reported Q2 sales up 20% y-o-y to $200.6bn. Operating profit was up 43% y-o-y to $27.5bn. Net profit was $62.6bn up from $18.2bn in Q2 2025. AWS sales were […] The post Amazon has Q2 sales of $200bn appeared first on Electronics Weekly .
Date: Wednesday, August 19, 2026 or Wednesday, August 26, 2026 This webcast will explain how and why Easy Drive SAR ADCs from Analog Devices can deliver the precision you need without the headache of high-speed ADC driver amplifiers. Join us for this webcast, where our expert will begin with an overview of why conventional SAR ADCs have historically […] The post Designing Efficient Signal Chains with Easy Drive ADCs appeared first on EE Times .
Physical AI wins by fusing sensors, edge compute, and feedback loops. Learn why systems, not TOPS, matter. The post Physical AI Isn’t Just Bigger AI; It’s a Systems Architecture Challenge appeared first on EE Times .
As satellite deployments accelerate and mission economics evolve, engineers face a growing challenge: balancing the reliability demands of space operation with the cost, lead-time, size, and technology limitations associated with traditional space-qualified components. Conventional qualification approaches provide proven reliability but often introduce lengthy procurement cycles, larger package footprints, higher mass, and restricted access to the […] The post Commercial Space Screening Approach for Agile, High-Reliability Payloads appeared first on EE Times .
AI workloads aren't creating new memory categories—they're sharpening the trade-offs between capacity, latency, and power. The post Dynamic AI Demands Drive Memory Diversity appeared first on EE Times .
From autonomous factories and AI-powered robots to connected vehicles and smart cities, organizations are entering a new era where connected systems are expected not only to collect data, but also to analyze, decide, and act in real time. As Industrial IoT continues to evolve, the focus has shifted beyond deploying connected devices. Today’s challenge is […] The post IoT Tech Expo Europe Returns to Amsterdam as Industrial AI and Edge Intelligence Reshape Connected Industry appeared first on EE Times .
Vimag Labs ditches rare-earth magnets with a wirelessly excited EV motor claiming PMSM-level punch. The post Indian Startup Vimag Labs Develops Wirelessly Excited Motor Without Rare-Earth Magnets appeared first on EE Times .
Discover Nidec's gear reducer solutions offering precise gear alignment, and low backlash for smooth, reliable operation under load. The post Nidec Positions Precision Reducers for Cobots, Humanoids, and Automation appeared first on EE Times .
Modular says Qualcomm is committed to keeping Mojo and Max hardware-agnostic as heterogeneous AI infrastructure moves from theory to reality. The post Why Qualcomm Bought An Open AI Software Stack appeared first on EE Times .
AI is squeezing software jobs; space and semiconductors are where tech turns physical. The post AI Is Compressing Software; Space Is Building the Physical Economy appeared first on EE Times .
Rapid military AI adoption brings critical security risks, leaving autonomous battlefield systems vulnerable to cyberattacks. The post Military AI Agents Under Cyberthreat: The Route Forward appeared first on EE Times .
HW methods to throttle AI; M3D DRAM; interconnect signal-integrity analysis; 3D mask effects in high/hyper-NA EUV litho; compute-in-interconnect and memory; NbAs nanowire interconnects; and 3D conformal thin-film patterning. The post Chip Industry Technical Paper Roundup: July 28 appeared first on Semiconductor Engineering .
Researchers from University of Lübeck published a technical paper titled “SPARC: Automated Root-Cause Analysis of Pre-Silicon Power Side-Channel Leakage in the Processor Design Flow.” Abstract Excerpt: “This paper presents SPARC, an automated framework for pre-silicon PSCL evaluation and root-cause analysis. SPARC leverages macro-cell-level Information Flow Tracking (IFT) augmented with enhanced shadow logic that tags switching... » read more The post Pre-Silicon Power Side-Channel Leakage In Processors (University of Lübeck) appeared first on Semiconductor Engineering .
Rethinking AI compute; DFI 6; 3D-IC reliability; local AI in browser; surface prep and cleaning. The post Blog Review: July 29 appeared first on Semiconductor Engineering .
As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec. The post Flat Enough? Warpage Management Gets Harder In Advanced Packaging appeared first on Semiconductor Engineering .
Researchers from NMIMS Hyderabad, IIT Roorkee, and BITS Pilani published a technical paper titled “Benchmarking LLMs for Verilog Design Flows.” Abstract Excerpt: The paper presents “aa reproducible benchmarking platform that evaluates open-source LLMs on Verilog RTL generation across 50 curated tasks consisting of combinational, sequential, finite state machine (FSM), and mixed designs,” and reports that... » read more The post Benchmarking Open-Source LLMs on Verilog RTL Generation Across 50 Tasks (NMIMS, IIT Roorkee, BITS Pilani) appeared first on Semiconductor Engineering .
Researchers from University of Houston, Toyota, and Imperial College London published a technical paper titled “Deployable 3D Architectures from Wafer-Fabricated Precursors.” The paper shows that “standard wafer fabrication can produce free-standing, mechanically stable, doubly-curved 3D structures with prescribed Gaussian curvature — a capability not previously achieved through semiconductor manufacturing” and points toward “realizable 3D semiconductor... » read more The post Deployable 3D Structures from Wafer-Fabricated Precursors (U. of Houston, Toyota, Imperial College London) appeared first on Semiconductor Engineering .
Researchers from Stanford University and Hanyang University published a technical paper titled “Bridging the p-type gap in oxide electronics with 2D semiconductors.” “The review assesses manufacturing-aligned pathways to high-performance 2D p-channel transistors, covering transfer-free low-temperature growth, clean van der Waals contacts, gentle p-doping, and mitigation of crystallization, volatility, and interdiffusion,” and also “a pragmatic outlook... » read more The post 2D P-Type Semiconductors with Oxide N-Channel Transistors For Complementary BEOL CMOS (Stanford, Hanyang) appeared first on Semiconductor Engineering .
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