Job Description
Test Equipment Engineer - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Test Equipment Engineer Home » Job Openings » Test Equipment Engineer Designation: Test Equipment Engineer Job Description: Kaynes semicon is looking for a skilled Test Equipment Engineer with strong technical back ground, must be passionate in trouble shooting test equipment’s, maintain test equipment’s and systems for Semiconductor device testing, collaborate with cross-functional teams to ensure efficient and accurate Testing, Purpose of the Job: To provide engineering & technical support on Evaluating / Installation /Buyoff / Setting up / PM/CAL for Test Equipment & interfaces (electrical & docking) that are used in the production testing of semiconductor ICs (Testers, handlers, Wafer Probers, Oven ..etc.) and to provide content expert support on final testing Key Job Accountabilities: Installation /Buyoff /Release of New IC testers, handlers and other wafer sort related equipment Install and buyoff to specs and ensure reliable functionality of the machines (Testers / Handlers / Probers) Expert Support on Trouble-shooting Testers, Handler Set Ups and other wafer sort Equipment To do repair and troubleshoot the issues encountered by Line Support/product engineering/mfg. Calibrate and maintain test equipment, carry out preventative maintenance and update PM records To establish & improve on operation /PM/CAL procedures for equipment Should be able to train others on these skills provide technical support and coaching to other Assistant engineers Prepare necessary training materials and provide hands on training/coaching on operation/PM/CAL Identify opportunities for upgrading equipment & streamlining maintenance operations, Knowledge, Skills, Abilities & improve equipment utilization Decrease equipment down time & improve overall equipment efficiency (OEE) Qualifications BE in Electrical/Electronics/Mechatronics or Diploma with 4+ years’ experience in Semiconductor Industry Hands on experience on Semiconductor equipment Advantest 93K, Teradyne UFEX, ETS#88, AccoTest, Aemulus , pick & place handlers & Wafer probers is an added advantage, Job Category: Post-Silicon Engineering Job Type: Full Time Job Location: Gujarat Apply for this position Full Name * Email * Phone * Bio * Upload CV/Resume * Allowed Type(s): .pdf, .doc, .docx By using this form you agree with the storage and handling of your data by this website. * Previous Post Test Associate Equipment Engineer Next Post Production Supervisor Share Share Share Share Pin Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram
