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[Samsung | Investment | Memory] Chinese DRAM maker ChangXin Memory Technologies is throwing its hat into the ring with a roughly $8.5 billion initial public offering as it seeks to challenge the dominance of Samsung Electronics, SK hynix and Micron Technology, The Korea Herald reported.
[Investment | Memory] Earlier today, shares in CXMT, China’s biggest DRAM company, opened 472% higher in their Shanghai IPO reaching a $487 billion valuation. The company, the world’s fourth largest DRAM vendor, raised […] The post CXMT IPOs at $487bn valuation appeared first on Electronics Weekly .
[Memory] CXMT eyes one of China’s largest semiconductor IPOs amid once-in-four-decades memory shortage. The post CXMT IPO: Where China’s Largest DRAM Maker Stands? appeared first on EE Times .
[Memory] CEA-Leti’s François Andrieu describes more embedded, persistent, and low-energy memories that will meet the growing demands of AI. The post CEA-Leti Looks Beyond SRAM and DRAM as AI Reshapes the Memory Roadmap appeared first on EE Times .
[AI | Memory] Near-memory HBM for LLM inference; processing-in-memory for 3D DRAM; SDV hardware abstraction; 3nm GAAFET SRAM self-heating and rad-hard; monolithic CMOS-photonic integration; quantum photonic chips; AI-driven thermal modeling for 3D photonic circuits. The post Chip Industry Technical Paper Roundup: July 21 appeared first on Semiconductor Engineering .
