Technology intelligence built from Inside Semicon's classified semiconductor news database.
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[Tata Semiconductor | Policy | Fab / Foundry] India Semiconductor Mission, Tata Electronics, and Tata Semiconductor Manufacturing Sign Fiscal Support Agreement for Semiconductor Fab PIB
[Intel | Investment] The stories cover MicroLED manufacturing, fabbing the Tesla A15 chip, and Bosch starting semiconductor production in the U.S. And there's also a major landmark for the Chinese space industry and Intel announcing a $5.7 billion capital investment in Fab 34 at Leixlip, Ireland... The post Most Read – Intel Leixlip, Tesla A15 chip, MicroLED manu...
[Intel | Manufacturing | Fab / Foundry] SANTA CLARA, Calif., June 18, 2026 — Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intel’s ability to deliver differentiated, system-level innovation for … The post...
[Keysight | Manufacturing | Fab / Foundry] Amkor's $1.5B deal; Intel Foundry revenue up 31%; Siemens' dual buys; SiC plant dies; AMD's big week; TSMC price hike; Nokia's fab buy; earnings; $300M for accelerating inference; Keysight's multiphysics; copper interconnect alternative. The post Chip Industry Week In Review appeared first on Semiconductor Engineering .
[Intel] Santa Clara, California, June 16, 2026 – At the 2026 VLSI Symposium, Intel Foundry provided an update on its process roadmap and long-term innovation investments. It shared that Intel 18A‑P, the first performance enhancement in the Intel 18A family, has entered risk production, meeting the timeline first shared with customers and partners last year.“Our updates … The post Intel Foundry Details Process Milestones and...
[Intel | Manufacturing | Fab / Foundry] Intel’s fabs are healing, but $293M in outside revenue won’t scare TSMC yet. The post Intel Foundry Improves Execution, but External Customers Remain the Test appeared first on EE Times .
[SEMI | Investment | Automotive] Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and alignment control at back-end volumes and costs. The post Can Fine-Pitch Hybrid Bonding Go High Volume? appeared first on Semiconductor Engineering.
