Technology intelligence built from Inside Semicon's classified semiconductor news database.
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[Cadence | Investment | AI] Intel's expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding; new CHIPS Act award; HBM standard; Quadric funding; AMS acquisition; earnings; Rapidus teams up. The post Chip Industry Week In Review appeared first on Semiconductor Engineering .
[NVIDIA | Analog / Mixed Signal] DAC 2026: Siemens has added new Nvidia AI software to its Intelligence Center X, creating a characterisation AI agent for self-verifying semiconductor and PCB design workflows. The autonomous and long-running […] The post Siemens adds characterisation AI agent to automate design iteration appeared first on Electronics Weekly .
[Design | Analog / Mixed Signal] At DAC 2026, chip giants stop waiting for EDA vendors and build their own AI brains—see who’s seizing control. The post DAC 2026: Users Are Not Waiting; DIY AI Is Now in Vogue appeared first on EE Times .
