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Semiconductor Manufacturing Wafer Fabrication CMOS MEMS Chip Design Packaging Testing Microelectronics

Latest Intelligence

01

NIELIT, SCL take chip design training beyond the classroom through 1.2-micron PDK with eChipHub - ET Government

[Micron | Policy | Chip Design] NIELIT, SCL take chip design training beyond the classroom through 1.2-micron PDK with eChipHub ET Government

02

Samsung Electronics Announces Earnings Guidance for Second Quarter 2026

[Samsung] Samsung Electronics today announced its earnings guidance for the second quarter of 2026. The above estimates are based on K-IFRS. Please note that Korean disclosure regulations do not allow earnings estimates to be offered as a range. To comply with such regulations, the above figures represent the median of the estimate ranges provided below. ※ [...

03

Hidden debt for obsolescent assets

[AI] Concern is growing about the amount of undisclosed debt taken on-board by hyperscalers to invest in rapidly obsolescing AI datacentres. The server replacement cycle in AI datacentres is now 18-36 […] The post Hidden debt for obsolescent assets appeared first on Electronics Weekly .

04

Pre-Silicon Power Side-Channel Leakage In Processors (University of Lübeck)

Researchers from University of Lübeck published a technical paper titled “SPARC: Automated Root-Cause Analysis of Pre-Silicon Power Side-Channel Leakage in the Processor Design Flow.” Abstract Excerpt: “This paper presents SPARC, an automated framework for pre-silicon PSCL evaluation and root-cause analysis. SPARC leverages macro-cell-level Information Flow Tracking (IFT) augmented with enhanced shadow logic that tags switching... » read more The post Pre-Silicon Power Side-Channel Leakage In Processors (University of Lübeck) appeared first on Semiconductor Engineering .