Defence · Bengaluru · Karnataka · India
[Cadence | Investment | AI] Intel's expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding; new CHIPS Act award; HBM standard; Quadric funding; AMS acquisition; earnings; Rapidus teams up. The post Chip Industry Week In Review appeared first on Semiconductor Engineering .
[Cadence | Design | Chip Design] Workshop on VLSI Chip Design using Cadence Nirma University
[Intel | Manufacturing | Fab / Foundry] SANTA CLARA, Calif., June 18, 2026 — Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intel’s ability to deliver differentiated, system-level innovation for … The post...
[Cadence | AI | AI] Rapidus and Cadence are getting together to advance agentic AI by integrating the Cadence InnoStackAI Super Agent into the Rapidus AI-Agentic Design Solution (Raads). The joint effort combines Rapidus’ AI-native […] The post Cadence and Rapidus hook up on agentic AI appeared first on Electronics Weekly.
[Samsung | Education | AI] Samsung Electronics a global leader in advanced memory technology, today announced mass production of PM1763, the company’s PCIe® 6.0-based enterprise solid state drive (SSD) optimized for next-generation AI and HPC server environments. As the volume of data required for AI training and inference continues to grow rapidly, enterprise SSDs (eSSDs) capable of delivering data quickly […]
[Intel | Jobs & Hiring] NEWS HIGHLIGHTS: The U.S. is at an inflection point. Artificial intelligence is reshaping global competition and increasing the need for secure, domestic semiconductor production. U.S. leadership in the AI era will be defined by innovation, domestic manufacturing, and workforce readiness. Strong semiconductor leadership is essential to economic growth, national security, and long-term global competitiveness. For …...
[Memory] CXMT eyes one of China’s largest semiconductor IPOs amid once-in-four-decades memory shortage. The post CXMT IPO: Where China’s Largest DRAM Maker Stands? appeared first on EE Times .
[Design | Verification] Last year, DAC's Engineering Track debated where verification is headed. This year in Long Beach, the emulation and prototyping hardware that will carry it takes center stage. The post From Future Vision To Running Hardware: Verification At DAC 2026 appeared first on Semiconductor Engineering .
[AI] The perennial Open v. Closed source debate has flared up in the AI industry with industry leaders taking sides. Last week a letter stating that Open Source software is “essential […] The post Open v. Closed source: AI industry row breaks out appeared first on Electronics Weekly .
Gartner urges supply chain leaders to quantify daily operational friction, making network investments more resilient and easier to justify. The post Supply Chain Leaders’ New Math for Network Decisions appeared first on EE Times .
The Department for Science, Innovation and Technology (DSIT) has been abolished with most of its functions taken over by the Department for Business, Innovation , Science and Trade (BIST). Jonathan […] The post Shake-up for tech ministers appeared first on Electronics Weekly .
[NVIDIA | AI] Max single-threaded CPUs at scale are a new category of CPUs built for the agentic AI era. Across the creation and deployment of an agentic system, the CPU is on the critical path for reasoning, response time and learning. CPUs are the processor which executes the work the AI model commands: the tool calling, code […]
[Samsung] Samsung Electronics today unveiled new Flex Titanium technology for the next generation of Galaxy foldable devices. Built on seven generations of foldable innovation and engineering expertise, the redesigned display structure utilizes structural and material advancements to deliver a more refined viewing experience with enhanced durability and reduced crease visibility. Made possible thanks to Samsung’s accumulated...
[Intel | Policy] Over the past year, we have laid the foundation for a new Intel. I have spent time with customers, industry peers, employees, and government leaders, and the message is clear: the world needs Intel at its best—an engineering‑first company that listens, learns, and executes.We are revitalizing our core businesses and rebuilding trust in our execution. … The post CEO Letter: 2025-26 Intel Corporate Responsibility...
[Cadence | Manufacturing | AI] Cadence has introduced the AuraStack AI Super Agent on Cadence Allegro AI Studio – an agentic AI platform for PCB and packaging design which spans system planning to final product […] The post Agentic AI platform for PCB and packaging appeared first on Electronics Weekly.
[KLA] Nidec tackles the brutal gearbox tradeoffs behind humanoid robots, from zero backlash to lighter integrated actuators. The post How Nidec Is Rethinking Gear Design for Humanoid and Mobile Robots appeared first on EE Times.
PYE’S plans to plant a foot firmly in the Common Market under the blue Italian sky follow a lead already made by a number of British firms in electronics. Indeed, […] The post Pye’s Plans appeared first on Electronics Weekly .
AI workloads aren't creating new memory categories—they're sharpening the trade-offs between capacity, latency, and power. The post Dynamic AI Demands Drive Memory Diversity appeared first on EE Times .
Open source software is a critical pillar of the global economy. It underpins cloud computing, financial services, manufacturing, telecommunications, government and internet services by making technology accessible and observable to communities of experts. Cybersecurity is among the top three beneficiaries of open source software. The Open Secure AI Alliance — building on the leadership of […]
On July 22 at Galaxy Unpacked July 2026, Samsung Electronics introduced intelligent eyewear as the first step toward making AI glasses the next interface for mobile AI. Built on decades of expertise in mobile engineering, hardware design and product craftsmanship, intelligent eyewear combines true wearability with mobile AI experiences and seamless connectivity within the Galaxy […]
LOI for CHIPS R&D award advances the optical technologies powering AI and high-performance computing MALTA, N.Y., July 29, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) today announced it has entered into a letter of intent (LOI) with the U.S.
NVIDIA and its partners are investing in American manufacturing, supply chains, energy grids and skilled workforces so the U.S. can produce the infrastructure needed for better healthcare, breakthrough scientific discovery, stronger industrial productivity and global technology leadership.
The complexity of modern chip design continues to grow as engineering teams work to develop increasingly sophisticated CPUs, GPUs and AI systems. To help meet that challenge, NVIDIA is collaborating with industry leaders Cadence and Synopsys to optimize critical electronic design automation (EDA) applications for the NVIDIA Vera CPU. NVIDIA is now deploying Vera across […]
At this week’s AI Summit in San Francisco, South Korean President Jae Myung Lee and some of the country’s top business leaders and researchers are meeting with NVIDIA and ecosystem partners to chart Korea’s AI progress. Building on NVIDIA founder and CEO Jensen Huang’s visit to Korea last month, this week’s discussions and announcements advance […]
Samsung Electronics America today unveiled Samsung Galaxy Card, a seamless way to earn cash rewards on everyday purchases with increased cash rewards for purchases made from Samsung — including the latest devices. Samsung’s first ever credit card offers a new financing option, whether you are giving the gift of Galaxy, treating yourself to a new device, […]
MALTA, N.Y., May 07, 2026 (GLOBE NEWSWIRE) -- Today at its 2026 Investor Day, GlobalFoundries (NASDAQ: GFS) highlighted clear opportunities for durable growth in AI-centric markets, expanding profitability and long-term value creation, underpinned by its broadening technology roadmap for the
