AI Executive Intelligence
[Design] The modular system, based on NI technology combines a high-performance FPGA core, for processing real-time data, and interchangeable SerDes interface devices which can be swapped according to the configuration requirements […] The post Modular test architecture is driving force for Emerson appeared first on Electronics Weekly .
Key Signals
Design,Industry,News,Chip Design
Article Summary
The modular system, based on NI technology combines a high-performance FPGA core, for processing real-time data, and interchangeable SerDes interface devices which can be swapped according to the configuration requirements […]
The post Modular test architecture is driving force for Emerson appeared first on Electronics Weekly.
Inside Semicon presents a concise intelligence summary. The original publisher remains the source of record.