Job Description
Failure Analysis Engineer - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Failure Analysis Engineer Home » Job Openings » Failure Analysis Engineer Job Description- Failure Analysis Engineer Key Responsibilities: Failure Analysis (FA): Conduct failure analysis on customer returns and reliability testing samples to understand why parts fail. Root Cause Investigation: Perform electrical testing (Curve Trace, ATE), non-destructive testing (X-ray, SAM), and physical destructive testing (De-capsulation , SEM, FIB, PEM, FTIR) to identify failure mechanisms. Reporting: Create detailed analytical reports for internal cross-functional teams and external customers. FMEA Contribution: Work with design and manufacturing teams on Failure Mode and Effects Analysis (FMEA) to mitigate risks. Product Improvement: Recommend design or manufacturing process changes to improve yield and reliability. Lab Maintenance: Maintain and calibrate analytical tools like Microscopes, FIB, SEM, and other FA tools Required Skills and Qualifications Education: NTTF/ Diploma/Bachelor’s or Master’s degree in Electrical/Electronics Engineering, Physics, or Materials Science. Experience: 1-6 years years of experience in semiconductor failure analysis. Technical Skills: Strong proficiency in operating FA equipment: Scanning Electron Microscope (SEM), Focused Ion Beam (FIB), X-Ray, SAM. Hardware debugging and circuit troubleshooting. Knowledge of semiconductor fabrication, assembly, and packaging techniques. Statistical data analysis (JMP, Excel). Soft Skills: Strong analytical problem-solving skills, technical writing abilities, and experience in cross-functional collaboration Note: Should be willing to work in Kaynes Semicon Sanand Gujarat facility. Job Category: Reliability Engineering & Failure Analysis Job Type: Full Time Job Location: Sanand - Gujarat Apply for this position Full Name * Email * Phone * Bio * Upload CV/Resume * Allowed Type(s): .pdf, .doc, .docx By using this form you agree with the storage and handling of your data by this website. * Previous Post Reliability Engineer Next Post Product & Test Engineer (Probe & Final Test) Share Share Share Share Pin Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram
