Gujarat Local Intelligence

GUJARAT
SEMICON.

ગુજરાતના સમાચાર • લોકો • સંસ્થાઓ • તકો
Click here for more details
Back to Jobs
Kaynes Semicon Inside Semicon Job #187

Reliability Engineer

✓ Official Career Gujarat Priority Design / VLSI
Sanand, Gujarat, India 1-5 years Full Time 2026-08-22
Job Source
Kaynes Semicon Careers
Retrieved from the official employer careers source.
Apply on Company Site

Job Description

Reliability Engineer - Kaynes Semicon Skip to main content Hit enter to search or ESC to close Search Close Search Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram Reliability Engineer Home » Job Openings » Reliability Engineer Job Description- Reliability Engineer Key Responsibilities: Reliability Testing: Develop and execute accelerated life tests (HTOL, HAST, Temperature Cycling) in accordance with JEDEC , AEC standards. Reporting: Create detailed analytical reports for internal cross-functional teams and external customers. FMEA Contribution: Work with design and manufacturing teams on Failure Mode and Effects Analysis (FMEA) to mitigate risks. Product Improvement: Recommend design or manufacturing process changes to improve yield and reliability. Lab Maintenance: Maintain and calibrate analytical tools like Environmental Chambers, Vibration Chambers, Mechanical shock chambers. Required Skills and Qualifications Education: NTTF/ Diploma/Bachelor’s or Master’s degree in Electrical/Electronics Engineering, Physics, or Materials Science. Experience: 1-5 years years of experience in semiconductor reliability test. Technical Skills: Strong proficiency in operating Environment chambers. Hardware debugging and circuit troubleshooting. Knowledge of semiconductor fabrication, assembly, and packaging techniques. Statistical data analysis (JMP, Excel). Soft Skills: Strong analytical problem-solving skills, technical writing abilities, and experience in cross-functional collaboration Note: Should be willing to work in Kaynes Semicon Sanand Gujarat facility. Job Category: Reliability Engineering & Failure Analysis Job Type: Full Time Job Location: Sanand - Gujarat Apply for this position Full Name * Email * Phone * Bio * Upload CV/Resume * Allowed Type(s): .pdf, .doc, .docx By using this form you agree with the storage and handling of your data by this website. * Next Post Failure Analysis Engineer Share Share Share Share Pin Quick Links About Us Engineering Domains Packages & Products Careers Contact us Corporate Office Kaynes Semicon Private Limited, Industrial Area II, Sanand, Gujarat PIN : 382170 Contact Us Email: in ** @ *********** on.com Terms of Use | Privacy Policy | Cookie Policy | Legal Disclaimer | Compliance Copyright © 2026 Kaynes Semicon. All Rights Reserved. Subsidiary of Kaynes Technology India Ltd Close Menu About Why Kaynes Semicon Exists Vision Mission Leadership & Management Manufacturing & Plant Footprint Global Map Engineering Domains Research & Development Outsourced Semiconductor Assembly & Test Post-Silicon Engineering Reliability Engineering & Failure Analysis Systems Solutions Group Original Design Manufacturer Packages & Products Packaging Platforms Quad Flat No-leads (QFN) Packages Small Outline Transistor (SOT) Packages Transistor Outline (TO) Packages Semiconductor Modules Ball Grid Array (BGA) Packages Flip Chip Ball Grid Array (FCBGA) Flip Chip Chip Scale Package (FCCSP) Test & Validation Multi-Chip Module (MCM) System in Package (SiP) Co-Packaged Optics (CPO) Investors Ecosystem Building Capability Strategic & Technology Collaborations Academic Network Policy & National Alignment Knowledge Hub Blogs And Articles News Insight – Events Careers Contact Us x-twitter linkedin instagram

Inside Semicon Job Verification

This opportunity was collected from an official employer career source. Inside Semicon links applicants back to the original company application page.

Inside Semicon provides semiconductor career discovery and employer-posting services. Job availability, recruitment decisions, compensation and final employment terms remain with the respective employer. Never make payments to unknown parties claiming to guarantee employment.